Microscopy lab and elemental mapping providers with MicroVision Laboratories? Conclusion: Based on the analytical report, the client was able to demonstrate that the particles were consistent with a common aspirin tablet. When the end customer was approached with this report, they remembered that their spouse had taken an aspirin earlier that morning, and had likely used the bottle of water in question to do so. Based on this, the customer was happy, the manufacturing client was satisfied, and the sample was maintained – undestroyed should someone need to examine the sample again or do any more esoteric testing. For an affordable price, the client was able to get piece of mind, and gather information from a very wide range of testing methods quickly and accurately.
SEM allows for high magnification surface examinations of a wide variety of samples. Providing brilliant resolution as well as incredible depth of field, the SEM, especially when combined with EDS, is often considered the most powerful analytical tool of our time. Let us show you why. X-ray imaging allows us to look inside of a device without opening it up. This real-time nondestructive inspection technique can be used on packaged electronic devices to one of a kind ancient artifacts. With rapid image acquisition and high sample throughput, X-ray imaging is particularly useful for sample screening and quality control issues. It is also often the first step in failure analysis and polished cross section projects.
What is your standard turnaround time (TAT) and can it be expedited? Our standard TAT is 5 to 10 business days. We can provide faster TATs on request with the following surcharges: – Same day to 24 hour rush is 100% surcharge – 2 day rush is 75% surcharge – 3 day rush is 50% surcharge – 4 day rush is 25% surcharge Rush requests must have prior approval otherwise we cannot guarantee turnaround times. Explore extra details at see it here.
The scan from left to right shows a high tin concentration (green line) while areas of higher lead concentrations (blue line) were not intersected by the line scan. At the interface between the tin/lead solder and copper (red line), there is a mixture of the solder and copper which is the intermetallic layer. The EDS Map provides a nice visual mixture of colors which shows the intermetallic layer while the line scan clearly shows the intermetallic with the elemental graph.
MicroVision Laboratories, Inc. has been providing extensive expertise in micro-analytical techniques (FE-SEM, SEM, EDS, XRF, FTIR testing, PLM, X-Ray Imaging, DIC) and sample preparation since 2003. Our cutting edge, high-performance equipment combined with our solutions-focused customer service provide critical solutions for clients hailing from a broad range of industries ranging from medical to semiconductor, and from environmental to textile.
Examining the sample with a polarized light microscope (PLM), it was darker and coarser than expected for a mold sample. The dust appeared to be a closed cell, synthetic blown foam material, and all from the same source. The black color was likely due to pigment particles added to color the foam. Fourier Transform Infra-Red spectroscopy was performed on the foam particles. The spectrum showed a mixture of spectral features, associated with vinyl acetates, polyurethane, and cellulose or other sugar-like polymers. Based on these features, a common urethane acetate foam was determined as the likely source material. See even more info at https://microvisionlabs.com/.
